IEC 62047-9 Ed. 1.0 b CORR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS en, Corrigenda by International Electrotechnical Commission, 03/08/2012
IEC 61800-3 Ed. 2.1 b:2012 [ Withdrawn ] Adjustable speed electrical power drive systems - Part 3: EMC requirements and specific test methods CONSOLIDATED EDITION standard by International Electrotechnical Commission, 03/08/2012
IEC 61000-4-15 Ed. 2.0 b CORR1:2012 Corrigendum 1 - Electromagnetic compatibility (EMC) - Part 4-15: Testing and measurement techniques - Flickermeter - Functional and design specifications en, Corrigenda by International Electrotechnical Commission, 03/05/2012
IEC 60601-2-33 Ed. 3.0 b CORR1:2012 Corrigendum 1 - Medical electrical equipment - Part 2-33: Particular requirements for the basic safety and essential performance of magnetic resonance equipment for medical diagnosis en, Corrigenda by International Electrotechnical Commission, 03/05/2012
IEC 60601-2-20 Ed. 2.0 b CORR1:2012 Corrigendum 1 - Medical electrical equipment - Part 2-20: Particular requirements for the basic safety and essential performance of infant transport incubators en, Corrigenda by International Electrotechnical Commission, 02/29/2012
IEC 60601-2-19 Ed. 2.0 b CORR1:2012 Corrigendum 1 - Medical electrical equipment - Part 2-19: Particular requirements for the basic safety and essential performance of infant incubators en, Corrigenda by International Electrotechnical Commission, 02/29/2012
IEC 60335-2-79 Ed. 3.0 en:2012 [ Withdrawn ] Household and similar electrical appliances - Safety - Part 2-79: Particular requirements for high pressure cleaners and steam cleaners standard by International Electrotechnical Commission, 02/28/2012
IEC 62047-14 Ed. 1.0 b:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials standard by International Electrotechnical Commission, 02/28/2012
IEC 62047-13 Ed. 1.0 b:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures standard by International Electrotechnical Commission, 02/28/2012
IEC 62047-10 Ed. 1.0 b CORR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials en, Corrigenda by International Electrotechnical Commission, 02/28/2012
IEC 62439-4 Amd.1 Ed. 1.0 b:2012 Amendment 1 - Industrial communication networks - High availability automation networks - Part 4: Cross-network Redundancy Protocol (CRP) Amendment by International Electrotechnical Commission, 02/24/2012
IEC 60344 TR Ed. 3.0 en CORR1:2012 Corrigendum 1 - Calculation of d.c. resistance of plain and coated copper conductors of low-frequency cables and wires - Application guide standard by International Electrotechnical Commission, 02/24/2012