Full Description

Provides a guide to an interconnection system for circuit board partitioning, allowing for a modular construction and solderless assembly of the sub-units.

Cross References:
BS 2011:Part 1.1
BS 2011:Part 2.1Ea
BS 2011:Part 2.1Eb
BS 2011:Part 2.1Fc
BS 2011:Part 2.1M
BS 5954:Part 2
BS 5954:Part 3
BS CECC 00015:Part 1
IEC 603-2

Product Details

Published: 03/15/1993 ISBN(s): 0580210677 Number of Pages: 40File Size: 1 file , 1.1 MB Product Code(s): 00292602, 00292602, 00292602 Note: This product is unavailable in United Kingdom