> IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ]
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IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ]

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IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ] Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

standard by International Electrotechnical Commission, 04/10/1997

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Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

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Edition: 1.0 Published: 04/10/1997 Number of Pages: 105File Size: 1 file , 500 KB Part of: IEC 61189-3 Ed. 1.1 b:2006