Full Description

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Product Details

Edition: 1.0 Published: 12/17/2002 Number of Pages: 93File Size: 1 file , 7.3 MB