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IEC 61188-1-2 Ed. 1.0 b:1998

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IEC 61188-1-2 Ed. 1.0 b:1998 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

standard by International Electrotechnical Commission, 04/29/1998

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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

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Edition: 1.0 Published: 04/29/1998 Number of Pages: 83File Size: 1 file , 470 KB