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IEC 62047-25 Ed. 1.0 b:2016

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IEC 62047-25 Ed. 1.0 b:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

standard by International Electrotechnical Commission, 08/29/2016

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IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

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Edition: 1.0 Published: 08/29/2016 Number of Pages: 45File Size: 1 file , 1000 KB