Full Description

Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

Product Details

Edition: 1.0 Published: 07/24/2006 Number of Pages: 19File Size: 1 file , 470 KB