Full Description

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Product Details

Edition: 1.0 Published: 11/29/2002 Number of Pages: 59File Size: 1 file , 3.5 MB