> IEC 60749-20 Ed. 1.0 b:2002 [ Withdrawn ]
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IEC 60749-20 Ed. 1.0 b:2002 [ Withdrawn ]

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IEC 60749-20 Ed. 1.0 b:2002 [ Withdrawn ] Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

standard by International Electrotechnical Commission, 09/30/2002

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Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

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Edition: 1.0 Published: 09/30/2002 Number of Pages: 49File Size: 1 file , 1.7 MB