> IEC 61190-1-2 Ed. 1.0 b:2002 [ Withdrawn ]
Sale! View larger

IEC 61190-1-2 Ed. 1.0 b:2002 [ Withdrawn ]

New product

IEC 61190-1-2 Ed. 1.0 b:2002 [ Withdrawn ] Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

standard by International Electrotechnical Commission, 03/22/2002

More details

$28.81

-57%

$67.00

More info

Full Description

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Product Details

Edition: 1.0 Published: 03/22/2002 Number of Pages: 35File Size: 1 file , 1.3 MB