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IEC 60749-7 Ed. 1.0 b CORR1:2003
IEC 60749-7 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases en, Corrigenda by International Electrotechnical Commission, 08/12/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-1 Ed. 1.0 b CORR1:2003
IEC 60749-1 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General en, Corrigenda by International Electrotechnical Commission, 08/12/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-9 Ed. 1.0 b CORR1:2003
IEC 60749-9 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking en, Corrigenda by International Electrotechnical Commission, 08/12/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-6 Ed. 1.0 b CORR1:2003
IEC 60749-6 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature en, Corrigenda by International Electrotechnical Commission, 08/12/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-4 Ed. 1.0 b CORR1:2003
IEC 60749-4 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) en, Corrigenda by International Electrotechnical Commission, 08/12/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-3 Ed. 1.0 b CORR1:2003
IEC 60749-3 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination en, Corrigenda by International Electrotechnical Commission, 08/12/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-10 Ed. 1.0 b CORR1:2003
IEC 60749-10 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock en, Corrigenda by International Electrotechnical Commission, 08/13/2003
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IEC 60749-20 Ed. 1.0 b CORR1:2003
IEC 60749-20 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat en, Corrigenda by International Electrotechnical Commission, 08/13/2003
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IEC 60749-13 Ed. 1.0 b CORR1:2003
IEC 60749-13 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-12 Ed. 1.0 b CORR1:2003
IEC 60749-12 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-11 Ed. 1.0 b CORR2:2003
IEC 60749-11 Ed. 1.0 b CORR2:2003 Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock -
IEC 60749-31 Ed. 1.0 b CORR1:2003
IEC 60749-31 Ed. 1.0 b CORR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) en, Corrigenda by International Electrotechnical Commission, 08/13/2003
$5.11 $11.88 -57%In Stock
