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IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ]
IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ] Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) standard by International Electrotechnical Commission, 04/10/1997
$67.51 $157.00 -57%In Stock -
IEC 61189-2 Ed. 1.0 b:1997 [ Withdrawn ]
IEC 61189-2 Ed. 1.0 b:1997 [ Withdrawn ] Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures standard by International Electrotechnical Commission, 04/10/1997
$71.38 $166.00 -57%In Stock -
IEC 61619 Ed. 1.0 b:1997
IEC 61619 Ed. 1.0 b:1997 Insulating liquids - Contamination by polychlorinated biphenyls (PCBs) - Method of determination by capillary column gas chromatography standard by International Electrotechnical Commission, 04/10/1997
$101.05 $235.00 -57%In Stock -
IEC 60079-5 Ed. 2.0 b:1997 [ Withdrawn ]
IEC 60079-5 Ed. 2.0 b:1997 [ Withdrawn ] Electrical apparatus for explosive gas atmospheres - Part 5: Powder filling "q" standard by International Electrotechnical Commission, 04/10/1997
$21.07 $49.00 -57%In Stock -
IEC 60748-22-1 Ed. 2.0 b:1997
IEC 60748-22-1 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures standard by International Electrotechnical Commission, 04/10/1997
$35.26 $82.00 -57%In Stock -
IEC 60748-22 Ed. 2.0 b:1997
IEC 60748-22 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures standard by International Electrotechnical Commission, 04/10/1997
$151.36 $352.00 -57%In Stock -
IEC 60748-21-1 Ed. 2.0 b:1997
IEC 60748-21-1 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part 21-1: Blankdetail specification for film integrated circuits and hybrid filmintegrated circuits on the basis of qualification approvalprocedures standard by International Electrotechnical Commission, 04/10/1997
$35.26 $82.00 -57%In Stock -
IEC 60748-21 Ed. 2.0 b:1997
IEC 60748-21 Ed. 2.0 b:1997 Semiconductor devices - Integrated circuits - Part 21: Sectionalspecification for film integrated circuits and hybrid filmintegrated circuits on the basis of qualification approvalprocedures standard by International Electrotechnical Commission, 04/10/1997
$70.52 $164.00 -57%In Stock -
IEC 60317-34 Ed. 2.0 b:1997 [ Withdrawn ]
IEC 60317-34 Ed. 2.0 b:1997 [ Withdrawn ] Specifications for particular types of winding wires - Part 34: Polyester enamelled round copper wire, class 130L standard by International Electrotechnical Commission, 03/27/1997
$17.63 $41.00 -57%In Stock -
IEC 61189-1 Ed. 1.0 b:1997
IEC 61189-1 Ed. 1.0 b:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology standard by International Electrotechnical Commission, 03/27/1997
$50.31 $117.00 -57%In Stock -
IEC 61773 Ed. 1.0 b CORR1:1997
IEC 61773 Ed. 1.0 b CORR1:1997 Corrigendum 1 - Overhead lines - Testing of foundations for structures en, Corrigenda by International Electrotechnical Commission, 03/27/1997
$5.11 $11.88 -57%In Stock -
IEC 60317-44 Ed. 1.0 b:1997
IEC 60317-44 Ed. 1.0 b:1997 Specifications for particular types of winding wires - Part 44: Aromatic polyimide tape wrapped rectangular copper wire, class 240 standard by International Electrotechnical Commission, 03/27/1997
$20.21 $47.00 -57%In Stock
![IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ]](https://www.filelook.org/img/p/en-default-home_default.jpg "IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ]")